Products

LED Substrate精密研磨
DL1/DL4
產品型號︰DL1/DL4
廠  牌︰Logitech
產品簡介︰LED樣品如Sapphire, SiC及GaN的晶片研磨
Product specification
Type DL1 DL4
Jig Capacity
PP9(up to 8”)
1 4
Plate Speed 0-160rpm 0-100rpm
Plate Diameter 560mm(22”) 700mm(27.6”)
Plate Rotation Counter clockwise Counter clockwise
Carrier Speed 10-125rpm 10-60rpm
Slurry Rate 20-500ml/min 20-500ml/min

原廠網站:

LED Substrate精密研磨 DL1/DL4

檔案下載:

影片連結:

Logitech Driven Head Lapping & Polishing Systems – DL/DP SiC, GaN, Sapphire研磨拋光系統

Logitech Hard Materials (SiC, GaN, Sapphire) – DL/DP研磨拋光系統產品介紹

product description

產品特色: 

  1. 可以同時研磨1 x 8吋wafer(DL1)或4 x 8吋 wafer(DL4)
  2. 特別適合研磨硬質樣品如Sapphire, SiC及GaN
  3. Driven Head Jig可以達到更高的研磨精準度
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