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Plate speed | 0-100 rpm |
Plate size | 400mm |
No. of Carriers | 2 |
Carrier Speed | 0-100rpm for Carrier 1 and Carrier 2 |
Max. Sample Size | 100mm(4”) x 2 samples |
Down Pressure | 0.4-9psi |
Back Pressure | 0-50 psi |
Conditioner | 採用工業級標準4.25” Conditioner |
操作介面 | PC Based Interface |
軟體功能 | 可監控及紀錄Load, CoF, Pad Wear, Pad Temp.等變化 |
監控系統 | End Point Detection(EPD) Function |
參數設定 | Carrier Speed, Plate Speed, Sweep, Amplitude, Download Pressure等 |
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Logitech Chemical Mechanical Polishing (CMP) Processes & Systems – 化學機械拋光機介紹
Logitech Chemical Mechanical Polishing (CMP) Processes & Systems–CMP Tribo化學機械拋光機介紹
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