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| Plate speed | 0-160 rpm |
| Plate size | 600mm |
| No. of Carriers | 2 |
| Carrier Speed | 0-125rpm for Carrier 1 and Carrier 2 |
| Max. Sample Size | 200mm(8”) sample x 1 + Conditioner x 1 |
| Down Pressure | 0.4-9psi |
| Back Pressure | 0-50 psi |
| Conditioner | 採用工業級標準4.25” Conditioner |
| 操作介面 | PC Based Interface |
| 軟體功能 | 可監控及紀錄Load, CoF, Pad Wear, Pad Temp.等變化 |
| 監控系統 | End Point Detection(EPD) Function |
| 參數設定 | Carrier Speed, Plate Speed, Sweep, Amplitude, Download Pressure等 |
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Logitech Chemical Mechanical Polishing (CMP) Processes & Systems – 化學機械拋光機介紹
Logitech Chemical Mechanical Polishing (CMP) Processes & Systems–CMP Orbis化學機械拋光機介紹
產品特色:
1.可選擇做In-Situ Conditioning的Wafer CMP或同時做兩片Wafer CMP
2.可以拋光Soft Materials and Hard Materials, 應用範圍廣
3.可以選擇不同種類的Carrier Head及Template做破片到8”wafer的CMP拋光
4.可以設定Down Load Pressure及Back Pressure做施加壓力及凹凸面的調整
5.軟體具有End Point Detection Function可以即時監控拋光情況
主要應用:
1.摩擦學(Tribology) Research, especially for CoF(Coefficient of Friction)
2.Silicon Wafer CMP
3.Global CMP of III-V Compound Semiconductors
4.Global CMP of Silicon Nitride, Oxides & Polymer Layers
5.Global CMP of brittle, friable IR material substrates
6.Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
7.Final stage thinning of SOS and SOI wafers to below 20 microns
8.Device delayering for Reverse Engineering or fault Analysis applications
