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Cat. No. |
Description |
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0CON-193 薄膜蠟 |
Thin Film Bonding Wax (50-55°C melting point). Designed to adhere to a wide range of substrates during slicing, dicing, lapping and polishing processes. |
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0CON-199 塑型蠟 |
Plasticized general bonding wax (57- 59°C melting point). Suitable for a wide range of temporary specimen bonding applications |
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0CON-200 石英蠟 |
Quartz wax (66-69°C melting point). Particularly suited to electro-optic and optical materials bonding / mounting applications. |
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0CON-324 磷苯二甲酸二醇酯 |
Glycol Phthalate. Suitable for bonding semiconductor wafers where high shear strength is required. 71 °C softening point, becomes fluid at around 122 °C. |
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0CON-178 去蠟液 |
Non-solvent cleaning fluid. Suitable for most sample and substrate cleaning applications including demounting ultra-thin semiconductor wafers. |
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0CON-166 83mm玻璃基板 |
Glass Substrate, 83mm diameter, pre-lapped parallel Float glass, pre-lapped parallel ma x error 2μm, Thickness - 6mm, Flatness 2μm |
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0CON-173 105mm玻璃基板 |
Glass Substrate, 105mm diameter, pre-lapped parallel Float glass, pre-lapped parallelmax error 4μm, Thickness - 6mm, Flatness 4μm |
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0CON-179 112mm玻璃基板 |
Glass Substrate, 112mm Float glass, pre-lapped parallel Glass, pre-lapped parallel max error 4 μm, Thickness - 6mm, Flatness - 4μm |
檔案下載:
Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors. Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques. Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.
Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.
Logitech cleaning fluids and powders are non-solvent based. They are suitable for most sample and substrate cleaning applications, including demounting of ultra-thin semiconductor wafers.
