Products

薄片貼合製具 Thin Section Bonding Jigs
BJ2, BJ6, BJ9, BJ12
產品型號︰BJ2, BJ6, BJ9, BJ12
廠  牌︰Logitech
產品簡介︰Bonding Jig是一種經濟型的樣品貼合工具,特別適用於地質樣品的薄片製作及光電半導體的小樣品薄片研磨拋光前處理之用。
Product specification

規格名稱

規格說明

BJ12

12 slides 28x48mm (1.10x1.89")

OR 12 at 26x76mm (1x3")

OR 12 at 35x45mm (1.37x1.76")

OR 8 at 50x76mm (2x3")

OR 4 at 76x110mm (3x4")

BJ9

6 slides 28x48mm (1.10x1.89")

OR 6 at 26x76mm (1x3")

OR 2 at 76x110mm (3x4")

OR 2 at 102x152mm (6x4")

BJ6

6 slides 28x48mm (1.10x1.89")

OR 6 at 26x76mm (1x3")

OR 2 at 50x76mm (2x3")

OR 2 at 76x110mm (3x4")

BJ2

2 slides 28x48mm (1.10x1.89")

OR 2 at 50x76mm (2x3")

OR 2 at 76x110mm (3x4")

OR 2 at 26x76mm (1x3")

檔案下載:

影片連結:

Logitech Geological Thin Section Preparation – 地質樣品鑲埋貼合介紹

product description

•Effective “zero bonding”
•Controlled thickness bonding
•Precise bond orientation
•Large or multiple sample capacity
•Bonding jigs available for large or small scale operations

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