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桌上型化學機械拋光機
CMP Tribo
產品型號︰CMP Tribo
廠　　牌︰Logitech
產品簡介︰桌上型化學機械拋光機, 可進行晶片CMP拋光測試, 並可做Tribology研究
Product specification
Plate speed 0-100 rpm
Plate size 400mm
No. of Carriers 2
Carrier Speed 0-100rpm for Carrier 1 and Carrier 2
Max. Sample Size 100mm(4”) x 2 samples
Down Pressure 0.4-9psi
Back Pressure 0-50 psi
Conditioner 採用工業級標準4.25” Conditioner
操作介面 PC Based Interface
軟體功能 可監控及紀錄Load, CoF, Pad Wear, Pad Temp.等變化
監控系統 End Point Detection(EPD) Function
參數設定 Carrier Speed, Plate Speed, Sweep, Amplitude, Download Pressure等

原廠網站:

桌上型化學機械拋光機 CMP Tribo

檔案下載:

影片連結:

Logitech Chemical Mechanical Polishing (CMP) Processes & Systems – 化學機械拋光機介紹

Logitech Chemical Mechanical Polishing (CMP) Processes & Systems–CMP Tribo化學機械拋光機介紹

product description

產品特色:

  1. 可選擇做In-Situ Conditioning的Wafer CMP或同時做兩片Wafer CMP
  2. 可以拋光Soft Materials and Hard Materials, 應用範圍廣
  3. 可以選擇不同種類的Template做破片到4”wafer的CMP拋光
  4. 可以設定Down Load Pressure及Back Pressure做施加壓力及凹凸面的調整
  5. 軟體具有End Point Detection Function可以即時監控拋光情況

主要應用:

  1. 摩擦學(Tribology) Research, especially for CoF(Coefficient of Friction)
  2. Silicon Wafer CMP
  3. Global CMP of III-V Compound Semiconductors
  4. Global CMP of Silicon Nitride, Oxides & Polymer Layers
  5. Global CMP of brittle, friable IR material substrates
  6. Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
  7. Final stage thinning of SOS and SOI wafers to below 20 microns
  8. Device delayering for Reverse Engineering or fault Analysis applications

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